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Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

机译：倒装芯片组装和底部填充应力;用aTC4.1装配测试芯片测量并用有限元法分析

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Peterson, D.W.; Sweet, J.N.; Burchett, S.N.; Hsia, A.;
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年度 1996
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入库时间 2022-08-20 21:04:59

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4. Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method [C] . Peterson, D.W., Sweet, Electronic Components and Technology Conference, 1997. Proceedings., 47th . 1997

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8. Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method [R] . Peterson, D. W., Sweet, J. N., Burchett, S. N., 1996

机译：倒装芯片组装和底部填充应力;用aTC4.1装配测试芯片测量并用有限元法分析

Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

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